IPD-产品开发流程-开发阶段活动说明(3)

硬件详细设 计 Perform Low Level Electrical Design: EE-60

基于硬件概要设计，使用标准的设计工具(根据情形选用RF/模拟/数字/ 芯片设计)来进行详细设计，描绘出明确的板、卡、元器件、要完成的 功能和界面；对每一个板/卡/元器件，开发电路设计，原理图，零部件清 单，网表等；按照测试计划合并测试点来支持测试；在数据库中维护设 计信息。 Based on the hardware high level design, use standard design tools (RF / Analog / Digital / Chip design, depending on the situation) to perform the low level design that lays out the specific boards, cards, components, functions performed and interfaces; for each board/card/component, develop the circuit design, schematic, part list, net list, etc.; incorporate test points to support testing per the test plan; maintain design information in a database.根据详细设计说明书、结构PCB要素图等文档的要求进行PCB板的布局、 布线和后仿真。 设计完成后投板。 具体过程见 《PCB设计投板流程》 (电子流) 。 Perform PCB layout and post simulation based on low level desogn specs and mechanical PCB elements diagram etc. See PCB design and making process (notes) 硬件工程师准备好相应的物料，单板PCB投板回来后，逐步加工好单板， 进行单板软硬件、逻辑调试，测试单板上模块电路特性是否符合设计要求。 Based on the low level design and the test plans, and depending on RF / Analog / Digital / Chip design, use appropriate design tools to take the circuit design, schematics, parts list, net list, test points, etc., and design board layouts and routings; perform analysis and simulation to identify and resolve problem areas such as hot spots, reliability, etc.; acquire the components, build the boards (either in-house or using a supplier), populate the boards and conduct unit testing; report and fix problems and keep track of changes by updating the documentation in the application-specific project database; report results of build and unit test; identify manufacturability/serviceability/quality/reliability issues and possible fixes 基于分配给软件的需求和规格，使用标准的设计工具(根据情形选用高 层次语言，CASE)来进行软件详细设计，描绘出详细的模块、要完成的功能、 输入、输出和界面格式。 Based on the requirements allocated to software and the specifications, use standard design tools (high level languages, CASE, depending on the situation) to perfor

m the low level software design that lays out the specific modules, functions performed, inputs, outputs and interface formats;

CAD设计 CAD design EE-65 单元测试 Develop Electricals / Unit Test: EE-90

软件详细设 计 Perform Low Level S/W Design SWE-50

编码 基于分配的软件需求和规格、软件详细设计，进行编码、链接编辑并且 Develop S/W 在编程数据库中维护代码及其历史资料。 / Unit Test: Based on the low level electrical design and offering specifications, select chip SWE-70 sets for offering subsystems or boards; set up development environments for chip sets; acquire, install and get trained in the use of the programming language/environment for the selected chip sets; based on the allocated embedded software requirements and specifications, develop code, link edit, test and debug code, and maintain the code and its history in the programming database 单元测试 Unit test SWE-72 进行测试和调试代码、并且在编程数据库中维护代码及其历史资料。 Test and debug the codes, and maintain the codes and historical data in the program database

结构造型详 细设计 Perform Low Level Mechanical Design: ME-50

基于分配到结构的需求和规格以及工业设计/人机工程设计的建议，使 用标准的设计工具(根据情形选用Pro/E, IDEAS, AutoCAD)来进行详细设计： 用结构设计图画出特定的机架子系统、面板、连接件、板、卡、线缆、冷却设 备、电源等；在数据库中维护设计信息。 Based on the requirements allocated to mechanical hardware and the specifications, and the briefations from the industrial/ergonomic design activity, use standard design tools (Pro/E, IDEAS, AutoCAD, etc. depending on the situation) to perform the low level design that lays out the specific rack subsystems, panels, connectors, boards, cards, wiring, cooling equipment, power supplies, etc. in mechanical design drawings; maintain design information in a database; 基于详细设计和测试计划，使用合适的设计工具进行强度及振动的细节 设计、分析和仿真；获得或构建结构元件，组装成机架(不管是自己还是供应 商装),装上各种板并进行单元测试，报告并解决问题，通过刷新特定的项目 数据库中的文件来跟踪更改；报告构建和单元测试的结果；明确可制造性/可服 务性/质量/可靠性问题及可能的解决办法。 Based on the low level design and the test plans, use appropriate design tools to perform detailed design, analysis and simulation of strength/vibration/; acquire or build the mechanical components, assemble the racks (either in-house or using a supplier), populate with prototype/sample boards and conduct unit testing; report and fix problems and keep track of changes by updating the documentation in the application-specific project database; report results of build and unit test; identify manufacturability/serviceab

ility/quality/reliability issues and possible fixes

结构试制/试 装/测试 Develop Mechanicals / Unit Test ME-70

BBIT(Build ing Block Integrate and Test) Building Block集成 和测试 EE-95, SWE-95, TE-50 Hardware Design Analysis 硬件设计 审查 TE45

BBIT验证构建模块的外部接口和与其他构建模块之间的接口，包括与已 有系统的接口，以及其他需要测试的部分。通过回归测试确保增加新的 Building Block后，已有系统能正常运行。 BBIT verify external interface of building block, interface with other building blocks, including the interface with existing system, and other test if needed. Perform regression test to ensure new add in building block is not break the existing system.

对单板硬件原理图、PCB等设计文件作设计审查分析，在底层设计上保 证测试对象功能实现上的可靠性与正确性。 测试工程师重点开展的是原理分析和可靠性分析，包括器件可靠性应用 分析，系统FMEA分析等。 Analysis design files of Board hardware schematics and PCB. Ensure the reliability and correctness of test objects function realization in low layer design. The accuracy is part TE focus on …… 此处隐藏：5152字，全部文档内容请下载后查看。喜欢就下载吧 ……